Bhubaneswar: India’s first advanced glass semiconductor packaging unit will be set up in Odisha. The groundbreaking ceremony of the proposed Heterogenous Integration Packaging Solutions (3D Glass Solutions) will be held in the capital city on April 19 (Sunday).

The project is likely to position Odisha as a global hub for advanced semiconductor manufacturing, said the state government on Saturday. 

The groundbreaking ceremony will be graced by Chief Minister Mohan Charan Majhi, Union Minister for Electronics & IT Ashwini Vaishnaw, and state Electronics & IT Minister Mukesh Mahaling. The event will also witness participation from senior government officials, global industry leaders, investors, and academia.

This pioneering project marks the arrival of the world’s most advanced chip packaging technology in India, firmly placing Odisha at the forefront of next-generation semiconductor innovation, added the state government.

Project to be set up with Rs 1,943 crore investment 

The project will be established with an investment of Rs 1,943 crore and it is likely to create around 2,500 direct and indirect jobs. As per the available data, the project will have the annual production capacity of 50 million assembled units.

Chips, designed in the unit, are likely to cater to key sectors including aerospace, defence, artificial intelligence, 5G technologies and Data Centres.

This milestone further strengthens Odisha’s semiconductor ecosystem, making it the first state in India to host both a compound semiconductor fabrication unit and an advanced 3D chip packaging facility based on glass substrates.

The initiative underscores the state government’s commitment to fostering high-tech industries, attracting global investments, and creating a robust innovation-driven economy aligned with the vision of Atmanirbhar Bharat.